Seems gimmicky. A Peltier device running at less than 3.5W (because that is shared with the fan and status LED) is probably only moving 3.5W of heat off the phone body, and then the fan appears to be blowing that heat right back onto the phone body. Plus, if you use this with the magnet pad, you probably aren't even making good thermal contact with the phone body in the first place. Probably not a coincidence that the press release of an article spends all its time on how little power it draws and how tasteful the LED is without any mention of temperature impacts
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I bought a watercooler version that was originally designed for a phone. It works pretty well, but mine is running at 100W.
I put it on the heatpipes for my laptop running local LLMs.
So far I thought that peltir should not be used to cool down electronics as it may lead to condensation and thus damage the components.
I suppose it would depend on if you design for that. For example, this board could be coated in epoxy to remove that risk. That would be preybad for repairability though
Isn't it a general issue if you have parts that are (significantly) colder than the surrounding air, no matter the material? If you turn on the peltir element and it reaches a temperature of X degrees on the cold side and the air around it has a temperature of X + Y, the air is chilled by Y and will thereby lower its ability to retain the moisture and form little droplets on the surface. The higher Y and the higher the relative moisture, the higher the effect.
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