Yes, there is a lot of potential. There are micro-spectrometers available covering this range, like the MEMS-FPI type spectrometer or the multi-pixel arrays with filters (example: https://www.mantispectra.com/products). But this new kind of detector seems to come with higher resolution, faster readout than the MEMS-FPI, and more sensitivity. It is quite exciting, I'm curious to see if they commercialize it soon.

I worked in contract manufacturing for making electronics.

We had certain contractual yields required. If the yield was below 90% (industry standard), they would pay us for the scrap. The assumption for that being they should have a confidence and reliability in their process that allows it to be higher. If we produced a higher yield than 90%, they got those for free.

Of course, yield numbers and reimbursement terms can be negotiated as part of the contracts.

I am not 100% sure, but I think that the designer bears the cost of the wafer yield.

The PDK is specific to the manufacturer, and I imagine that the risk associated with specific features is known and the yield range can be estimated. A design with more and riskier the features would lower the expected yield, and it makes sense that this risk gets passed onto the designer. The contract may have some protections for the case when the yield is significantly lower than expected because of the manufacturer's fault. Just a guess though, it would be great if someone with real experience can answer.