1 ▲ 33 ▼ IBM goes sub-1nm, develops 0.7nm-class technology — offering up to 50% higher performance and 70% higher energy efficiency compared to IBM's 2nm-class node (www.tomshardware.com) submitted 4 months ago by cm0002@infosec.pub to c/semiconductors@mander.xyz 2 comments +1 crosspost fedilink
2 ▲ 2 ▼ Fujitsu taps Broadcom's 3D chip tech for 144-core Monaka CPU (www.theregister.com) submitted 8 months ago by cm0002@infosec.pub to c/semiconductors@mander.xyz comment fedilink
3 ▲ 1 ▼ Qualcomm Snapdragon X2E-96-100 Specs (www.techpowerup.com) submitted 8 months ago by cm0002@infosec.pub to c/semiconductors@mander.xyz comment fedilink
4 ▲ 5 ▼ Taiwan chipmaker TSMC begins 2nm chip volume production (techxplore.com) submitted 10 months ago by noumenon@lemmy.world to c/semiconductors@mander.xyz comment +2 crossposts fedilink
5 ▲ 13 ▼ Mushrooms show promise as memory chips for future computers (phys.org) submitted 1 year ago by cm0002@lemmy.zip to c/semiconductors@mander.xyz comment +1 crosspost fedilink
6 ▲ 13 ▼ Samsung takes a scalpel to its 2nm wafer price tag, bringing it down to $20,000 — Korean chipmaker now undercuts rival TSMC by 33% (www.tomshardware.com) submitted 1 year ago by cm0002@piefed.world to c/semiconductors@mander.xyz 1 comment +3 crossposts fedilink
7 ▲ 1 ▼ How AMD is re-thinking Chiplet Design | High Yield [24:20] (www.youtube.com) submitted 1 year ago by ThorrJo@lemmy.sdf.org to c/semiconductors@mander.xyz comment +1 crosspost fedilink Strix Halo Chip Deep-dive with a focus on AMD's next-gen die-to-die fan-out interconnect.
8 ▲ 5 ▼ The Most Scalable Semiconductor | Asianometry [20:25] (www.youtube.com) submitted 1 year ago by ThorrJo@lemmy.sdf.org to c/semiconductors@mander.xyz comment fedilink
9 ▲ 6 ▼ Japan storms back into the chip wars (www.economist.com) submitted 1 year ago by z3th@lemmy.world to c/semiconductors@mander.xyz comment fedilink "The country used to be a semiconductor powerhouse. Can it be one again?"
10 ▲ 5 ▼ How AI Will Impact Chip Design And Designers (semiengineering.com) submitted 1 year ago by cm0002@lemmy.world to c/semiconductors@mander.xyz 2 comments fedilink
11 ▲ 1 ▼ Kioxia and SanDisk start shipping BiCS9 3D NAND samples — hybrid design combining 112-layer BiCS5 with modern CBA and Toggle 6.0 interface for higher performance and cost efficiency (www.tomshardware.com) submitted 1 year ago by cm0002@lemmy.world to c/semiconductors@mander.xyz comment fedilink
12 ▲ 2 ▼ Cost effective method developed for co-packaging photonic and electronic chips (techxplore.com) submitted 1 year ago by cm0002@lemmy.world to c/semiconductors@mander.xyz comment fedilink
13 ▲ 19 ▼ Michigan loses massive semiconductor plant. Whitmer blames ‘national economic turmoil’ (www.bridgemi.com) submitted 1 year ago by cm0002@lemmy.cafe to c/semiconductors@mander.xyz comment fedilink
14 ▲ 9 ▼ GlobalFoundries to make RISC-V CPUs — fab acquires MIPS, will integrate RISC-V and AI IP into its portfolio (www.tomshardware.com) submitted 1 year ago by cm0002@lemmy.cafe to c/semiconductors@mander.xyz comment +1 crosspost fedilink
15 ▲ 5 ▼ Samsung’s Taylor Facility Opening in the U.S. Reportedly Delayed To 2026 as the Korean Giant Struggles to Secure Customers (wccftech.com) submitted 1 year ago by cm0002@lemmy.cafe to c/semiconductors@mander.xyz comment fedilink
16 ▲ 7 ▼ Struggling Semiconductor Firm Wolfspeed Files for Bankruptcy (www.bloomberg.com) submitted 1 year ago by cm0002@lemmy.world to c/semiconductors@mander.xyz comment fedilink
17 ▲ 3 ▼ Chip Industry Week in Review (semiengineering.com) submitted 1 year ago by cm0002@lemmy.world to c/semiconductors@mander.xyz comment fedilink
18 ▲ 3 ▼ Intel vets break ranks to build the biggest, baddest CPU (www.fudzilla.com) submitted 1 year ago by cm0002@lemmy.world to c/semiconductors@mander.xyz comment fedilink