Once the PCB is heat soaked its basically useless at thermal disippation because fibreglass/resin (PCB) is an insulator. There is research being done to make micro channels into the silicon to directly water cool the chips but i doubt it will eer get to market or even be made for industry though

https://youtu.be/WRm6N1A74oE Oh and a few years ago buildzoid explains why having a heatsink that has the fins going length wise suck (aka blower heatsinks)

Striped together. It's already got the red stripe for speed.

Some other factors to consider:

• Parallel-to-slot (long) fins can make it harder to effectively use multiple fans because the airflow directions (once the air is redirected upon hitting the GPU heatsink) will clash between each fan (see image).
• Heatpipe design might be simpler or better when the pipes are mostly-straight across the perpendicular-to-slot (short) fins compared to having to have bent pipes of much more variable length.
• Short fins themselves might be easier or cheaper in manufacturing somehow?
• Long fins can mean that air spends more time being heated before being ejected (making its average temperature higher before ejection, lowering heat transfer).

MOAR!

I reckon I could buy a house for a similar cost as a that card, full of M2 drives.

I think I saw some company advertising having specially added heat dissipation channels inside the PCB, near some hot components.

Well of course and so is the lid of the processor die and the material used to paste the lid onto the die.

When I think of cooling, I first think of the processor die's surface area, then the lid, then the heatsink after which come the fans.
The heatsink being an important part here, since that determines how much of a difference a fan will make.

e.g. I recently changed the heatsink on my SSD from the one provided with the motherboard to another one with some fins and placed a NF-A4x10 (x20 was unavailable) to point in its direction to get ~4℃ (yeah, just that and it is still ~15℃ over ambient, when idle (state 4)) of better cooling performance. Though I am yet to experiment with other fan directions and the fins are not particularly made to be used with a fan either. But still, a design with fins would be better than just a block of metal.

I see, so the ⟂ orientation might actually be better and if the other variables, like fan quality and fin material were the same, I could have expected an increase in cooling performance.

you cant really compare the heat output of the 2 cards

Yeah, that's the main reason I didn't try to be comprehensive about it.

gpu fans arr designed for high static pressure

I hope so. The fans along with the rest of the cooling system on the ASRock card seems just low quality, as compared to the MSI one (and I would have bought an MSI card if it were available at the time) and that is reflected in the memory temps, despite me making sure that it had a thermal pad, connecting the heatsink to the memory modules, unlike the ASUS cards.

3.50?

Not a real homelab, that's for sure.

Is it even a homelab without one of these and another one stored away as a backup

I need this for my homelab...

This is what one of our engineers found out when trying to pick an orientation for an FPGA heatsink on a board, fins inline with the chassis fans or perpendicular and he found that the perpendicular placement stayed cooler since the heatsink had a fan blowing the hot aire to both sides and the chassis fans blowing it away than having the fan on the heatsink fight the incoming air from one side and exhaust from one side

MORE

More

How does the cost compare to a jbod enclosure?

Speculation: the airflow on the GPU fans completely dominates the airflow on the GPU's heatsink, making "ambient" airflow direction essentially irrelevant for airflow that goes directly across that heatsink except as it pertains to reaching those GPU fans.

Having the short-fin direction also allows significantly more "exhaust area" for the GPU's hot air than the long-fin direction (effectively both long sides are "GPU exhaust" instead of both short sides being "GPU exhaust") and additionally the exhaust that would face into the front of the case -- which I assume would be less efficient due it fighting incoming airflow -- doesn't have to be used.

The PCB too if you want to be a jackass about it

If you want to get technical, the heatsink/fins helping to move heat away from the chip (regardless of any fans) can also be considered "cooling".

570 TDP is 150w 14nm 7600 165w 6nm

Sorry but you cant really compare the heat output of the 2 cards.

If you had a passive cooler airflow would make a difference but the fans on a GPU are what do the cooling. The only thing those front fans do is provide cold air. The gpu fans arr designed for high static pressure, something a fan not touching the fin stack can't do.

Also changing the orientation of the GPU can have negative effects due to the heat pipes being designed for a specific orientation. See AMD 7xxx reference card debacle.

Just wanted to say this seems like a good summation and reporting.

I have seen my old RX 570 from MSI, work much cooler even with an absurd amount of dust in it than the ASRock 7600 and also noticed after the recent upgrade to my front inlet fans that they hardly made a difference to the GPU temps, which lead me to put some brain-time into modelling the airflow due to this GPU's fins.

All raspberry alternatives have the same major problem of SW support. It's always a pain to deal with.

My main NAS for about 4 years was built around a Rockchip SBC and HW video acceleration was only available on an ancient kernel version and a distro provided by the manufacturer distributed on an obscure Google Drive. I gave up on that feature and decided to run the latest Armbian release on it and it was working pretty reliably, but it was frustrating experience overall.